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INVENTORS: Danforth; Stephen C. (Belle Mead, NJ); Safari; Ahmad (Princeton Junction, NJ); Ballato; John (Central, SC); Van Weeren; Remco (Oldwick, NJ); Bandyopadhyay; Amit (Edison, NJ).
ASSIGNEES: Rutgers, The State University (New Brunswick, NJ).
U.S. CLASS: 264/401; 264/219; 264/308; 264/317; 264/603; 347/1; 419/1; 419/36
ABSTRACT: Solid freeform fabrication techniques are used in direct methods to form photonic bandgap structures, and in indirect methods to form molds for photonic bandgap structures. In the direct methods, solid particulate materials are mixed with a binder and, through a computer-controlled process, are built layer by layer to form the structure. In the indirect methods, unfilled polymeric materials are built layer by layer to form a negative mold for the photonic bandgap structure. The cavities within the mold may then be filled with a slurry incorporating solid particulate materials. Subsequent processing may include mold removal, binder removal, densification and secondary infiltration steps to form a photonic bandgap structure having the desired properties. XX
