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INVENTORS: Cohen; Adam L. (Rancho Palos Verdes, CA).
ASSIGNEES: University of Southern California (Los Angeles, CA).
U.S. CLASS: 205/135; 205/118
ABSTRACT: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed. XX
