2003 / Solid Freeform Fabrication Proceedings
PREV and NEXT link to numerically adjacent references for this YEAR.
CONTENTS links to the title list for this YEAR's references.
Author Evan Malone, Kian Rasa, Daniel Cohen, Todd Isaacson, Hilary Lashley, Hod Lipson Computational Synthesis Laboratory, Department of Mechanical and Aerospace Engineering, Cornell University, Ithaca NY 14853 USA em224@cornell. edu
Source Solid Freeform Fabrication Proceedings, 2003, pp 363-374.
Abstract This paper reports on a fabrication platform and extensions to deposition-based processes that permit freeform fabrication of three-dimensional functional assemblies with embedded conductive wiring and power sources. Structure and joints are produced by fused deposition of thermoplastics and deposition of elastomers. Conductive wiring is achieved by deposition of various low-melting-point alloys and conductive pastes. Batteries based on zinc-air chemistry are produced by deposition of zinc, electrolyte, and catalysts, with separator media and electrodes. Details of the deposition processes are provided and several printed assemblies are demonstrated. (Auth abstract) [References: 16] XX
Solid Freeform Fabrication Proceedings can be obtained from: The Solid Freeform Fabrication Symposium
or contact:
The University of Texas at Austin
Laboratory for Freeform Fabrication / Texas Materials Institute
Mechanical Engineering Dept.
c/o The Solid Freeform Fabrication Symposium
MC C2200
Austin, TX 78712-1063 USA
512-471-3026; 512-471-7681 FX; Email: sffsymp@uts.cc.utexas.edu