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The usual problem in most additive manufacturing processes is to make layers as thin as possible in order to provide high resolution and good accuracy. But the EFAB process [Electrochemical Fabrication] from Microfabrica, Inc. already has very thin layers. In contrast, with EFAB it's desirable to modify the process to provide thicker layers to accommodate faster build times and taller devices. Being able to mix and match layer heights within the same part is also desirable.
Microfabrica has done just this with its latest technology extension. Many tens of layers of varying-thickness can be stacked on top each other to fabricate complex, 3D microdevices. EFAB is a batch layered-fabrication technique that is used to produce parts and assemblies from the micron scale up to the mesoscale of a few millimeters. The technology is based on selective electroplating through conformal masks, and is said to be capable of producing parts with literally hundreds of layers. |
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These extended capabilities allow the fabrication of micro-structures with layer thickness up to 50 microns. The company says this offers a low-cost alternative to high aspect ratio micromachining technologies such as LIGA [Lithographie, Galvanoformung und Abformung]. Applications for the new capabilities include inkjet printhead nozzles, inertial measurement units, magnetic microsystems and safing/arming/fuzing devices.
"By combining the high aspect ratio advantages of LIGA with the geometric flexibility of surface micromachining, EFAB has become the most versatile microfabrication technology available, making previously unrealized products and applications possible for the first time," said Chris Bang, VP of Design and Applications Engineering at Microfabrica.
For more info Contact:
Mr. Dan Feinberg, Dir. of Sales & Mktg.
Microfabrica Inc.
1103 W. Isabel Street
Burbank, CA 91506
818-295-3996 x125
818-295-3998 FX